期刊论文：

1. Liangzheng Ji, Xinyue Wang, Wenting Liu, Xin Wang, Wenwu Guo, Guoqi Zhang, Jing Zhang, Pan Liu, “Tin fog effect analysis during fluxless soldering under reflow with formic acid: Methodology, mechanism, and reliability impact”, Volume 36, May–June 2025, Pages 5366-5380.

2. Yuhan Duan, Botao Sun, Lindong Ma, Pan Liu, Guangyin Lei, Jiajie Fan, Bo Gao, Qingchun Jon Zhang and Bo Wang, “Impact of electric field reconstruction on gate oxide degradation in 1200 V 4H–SiC MOSFET induced by heavy ion radiation”, J. Phys. D: Appl. Phys. 58 (2025) 225109.

3. Tang, Jiuyang; Duan, Yuhan; Liu, Pan, Investigation of Degradation and Failure Mechanism in 1200V Planar SiC MOSFET Under Statical Accelerated Lifetime Test, Transactions on Device and Materials Reliability, Accepted (2025)

4. Wenting Liu, Xinyue Wang, Jing Zhang, Guoqi Zhang, Chuantong Chen, Pan Liu, “Quartet Structure Generation Set Algorithm Based 3D Reconstruction on Porous Structures of Sintered Copper Joints for Power Electronics Packaging”, Scripta Materialia, accepted. (2025)

5. Yuhan Duan, Botao Sun, Yuanlan Zhang, Pan Liu, Guangyin Lei, Min Li, Qingchun Jon Zhang, “Comparative Study of Different Layouts for 1.7kV Charge-Balance-Assisted SiC MOSFETs”, International Symposium on Power Semiconductor Devices and ICs (ISPSD), Accpeted. (2025)

6. Xinyue Wang, Haixue Chen, Zhoudong Yang, Wenting Liu, Zejun Zeng, Guoqi Zhang, Jing Zhang, Jiajie Fan, Pan Liu, Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures, Journal of Materials Research and Technology, Volume 30, 2024, Pages 8433-8450.

7. Liangzheng Ji, Jing Zhang, Guoqi Zhang, Pan Liu, “A Polyamide-facilitated Soldering Approach for Mini LED Precise Alignment Leveraging 3D Interfacial Networks”, Journal of Science: Advanced Materials and Devices, vol 9, 2024, 100817. 

8. Wenting Liu, Xinyue Wang, Jing Zhang, Guoqi Zhang, Pan Liu, ”Al-clad Cu bond wires for power electronics packaging: Microstructure evolution, mechanical performance, and molecular dynamics simulation of diffusion behaviors”, Materials Today Communications, vol 41, 2024, 110940.

9. Yifei Chang, Jiaxuan Wang, Hao Guan, and Pan Liu, 1200V-Trench-FS IGBT: Process-based modeling and Short Circuit Safe Operating Area (SCSOA) optimization with the TOPSIS method, in IEEE Transactions on Electron Devices, doi: 10.1109/TED.2024.3489603. (Q2, IF 2.9)

10. J. Wang and P. Liu, Life Cycle Assessment (LCA) and Multi-Criteria Decision Making (MCDM): An Evaluation of Encapsulants for Power Electronics Packaging, in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 8, pp. 1501-1510. 

会议论文：

1. Yuhan Duan, Botao Sun, Yuanlan Zhang, Pan Liu, Guangyin Lei, Min Li, Qingchun Jon Zhang, “Comparative Study of Different Layouts for 1.7kV Charge-Balance-Assisted SiC MOSFETs”, International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2025.

2. Hao Guan, Yifei Chang, Pan Liu, Simulation, Verification, and Failure Analysis of Fast Recovery Diodes for the Surge Current Capability,  in Proceedings of the 26th Electronics Packaging Technology Conference (EPTC 2024), Singapore, 2024, pp.1-6.(Student travel award)

3. L. Ji, W. Guo, G. Zhang, J. Zhang and P. Liu, An Investigation of Process Parameters Effects on Void Formation in Fluxless Solder Paste for Power Module Packaging Applications via Formic Acid Vacuum Reflow Technology, 2024 25th International Conference on Electronic Packaging Technology (ICEPT), Tianjin, China, 2024, pp. 1-5. (Best paper award)

4. R. Luo, Y. Duan, B. Sun, J. Q. Zhang, J. Fan and P. Liu, Total Ionizing Effects on Static Characteristics of 1200V SiC MOSFET Power Devices with Planar and Trench Structures, 2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS), Xiamen, China, 2023, pp. 88-91. (Best poster award)

5. X. Wang, Z. Yang, G. Zhang, J. Zhang and P. Liu, Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1982-1988. （Best Student Paper）