1、P. Liu, J. Li, H. v. Zeijl and G. Zhang, Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 817-823, doi: 10.1109/ECTC32862.2020.00133.

2、P. Liu et al., Thermal Simulations of a UV LED module with nanosilver sintered die attach process on graphene-coated copper substrates, 2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS), Shenzhen, China, 2019, pp. 93-97, doi: 10.1109/SSLChinaIFWS49075.2019.9019813.

3、P. Liu, H. W. van Zeijl, M. R. Venkatesh, R. Sokolovskij, R. Kurt and G. Q. Zhang, Review on retrofit G4 LED lamps: Technology, challenges, and future trends, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015, pp. 2277-2282.

4、R Sokolovskij, P Liu, H W van Zeijl, B Mimoun, and G Q Zhang, “Design and fabrication of a foldable 3D silicon based package for solid state lighting applications”, Journal of Micromechanics and Microengineering, Volume 25, Number 5.

5、P. Liu, J. Zhang, R. Sokolovskij, H.W. Zeijl, B. Mimoun, G.Q. Zhang, “Geometric optimization of high performance interconnect of Rigid/Flexible/Rigid substrate for Wafer Level Packaging in Solid State Lighting applications by numerical simulations”. 1-6. 10.1109/EuroSimE.2013.6529982.

6、R Venkatesh, Manjunath & Liu, Pan & Zeijl, H.W. & Zhang, G.Q.. (2014). Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications. 1-6. 10.1109/EuroSimE.2014.6813865.

7、P. Liu, H. W. van Zeijl, R. Kurt, G. Q. Zhang. Simulation of LED lamps with different integration methods for retrofit G4 halogen lamps application. China SSL 2012.

8、O. Isabella, P. Liu, B. Bolman, J. Krc, A. H. M. Smets and M. Zeman, Modulated surface-textured substrates with high haze: From concept to application in thin-film silicon solar cells,2011 37th IEEE Photovoltaic Specialists Conference, Seattle, WA, 2011, pp. 000616-000621.

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